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D1213A-02SOL
Maximum Ratings @T A = 25°C unless otherwise specified
Characteristic
Peak Pulse Current (Note 7)
ESD Protection – Contact Discharge
ESD Protection – Air Discharge
Symbol
I PP
V ESD_Contact
V ESD_Air
Value
5
±8
±15
Unit
A
kV
kV
Conditions
8/20 μ s, Per Fig. 2
Standard IEC 61000-4-2
Standard IEC 61000-4-2
Thermal Characteristics
Characteristic
Package Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating Temperature Range
Storage Temperature Range
Symbol
P D
R θ JA
T J
T STG
Value
300
417
-55 to +125
-65 to +150
Unit
mW
° C/W
° C
° C
Electrical Characteristics @T A = 25°C unless otherwise specified
Characteristic (Note 7)
Reverse working voltage
Reverse current (Note 6)
Reverse breakdown voltage
Forward voltage
Reverse clamping voltage, Positive Transients
Reverse clamping voltage, Negative Transients
Dynamic resistance
Capacitance
Symbol
V RWM
I R
V BR
V F
V CL1
V CL2
R DYN
C T
Min
-
-
6.0
0.6
-
-
-
-
Typ
-
0.1
7.5
0.8
10.0
-1.7
0.9
0.85
Max
3.3
1.0
9.0
0.95
-
-
-
1.2
Unit
V
μ A
V
V
V
V
?
pF
Test Conditions
-
V R = V RWM = 3.3V
I R = 1mA
I F = 8mA
I PP = 1A, t p = 8/20 μ s
I PP = -1A, t p = 8/20 μ s
I R = 1A, t p = 8/20 μ s
V R = 1.65V, f = 1MHz
Notes:
5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
6. Short duration pulse test used to minimize self-heating effect.
7. Measured between any channel and GND
100
100
75
50
50
25
0
0
25
50 75 100 125 150 175
T A , AMBIENT TEMPERATURE (°C)
Fig. 1 Pulse Derating Curve
200
0
0
20 40
t, TIME ( μ s)
Fig. 2 Pulse Waveform
60
D1213A-02SOL
Document number: DS35607 Rev. 3 - 2
2 of 4
May 2012
? Diodes Incorporated
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